WP6: Hybrid Pixel Sensors for 4D Tracking and Interconnection Technologies

Objectives

Task 6.1. Coordination and Communication
• Management and coordination of the Work Package, including monitoring of work progress, budget spending and
reporting to the project management.
• Organisation of WP meetings as well as meetings with other WPs and coordinating presentation of results within
AIDAinnova and to the detector community.

Task 6.2. Simulation and processing of common 3D and LGAD sensor productions
• Optimisation of processes for 3D and LGAD sensors for timing applications
• Simulations of various designs for 3D and LGAD sensors to compare and optimise the layout in terms of timing
performance
• Simulations of surface and bulk radiation damage for 4D (tracking+timing) detectors toward more radiation tolerant
solutions
• Processing of two common 3D sensor productions and two common LGAD productions by FBK/CNM
• Design and implementation of simulation software which is applicable to a large range of technologies and includes
models for the description of effects from sensor level to readout electronics in semiconductor detectors

Task 6.3. Validation of common 3D and LGAD sensor productions
• Characterisation of the 3D sensors in terms of timing, radiation hardness, efficiency and uniformity via measurements
in the laboratory and beam tests
• Characterisation of small pitch LGAD and inverse LGAD sensors (iLGADs) from the common production in terms
of timing and efficiency via measurements in the laboratory and beam tests
• Feedback to the foundries for further process optimisation of 3D and LGAD sensors

Task 6.4. Development of interconnection technologies for future pixel detectors
• Development of suitable Anisotropic Conductive Films (ACF) material and die-to-die bonding process flows for small
pixel pitches
• Production and post-processing of dedicated planar sensor wafers for ACF trials
• Test of the performance of sensor modules interconnected with ACF
• Production and test of ultra-thin assemblies interconnected with a wafer to wafer bonding technology
• Post-processing of sensor prototypes developed in Task 6.3

Tasks

Task #	Task name	Task leader
6.1	Coordination and communication
6.2	Simulation and processing of common 3D and LGAD sensor productions
6.3	Validation of common 3D and LGAD sensor productions
6.4	Development of interconnection technologies for future pixel detectors

Milestones

MS #	Milestone name	Lead beneficiary	Due Date (in months)	Means of verification
MS22	Wafer layout	20 – FBK	23	Layout design file and report on the design choices, supported by simulations (Task 6.2)
MS23	Preliminary characterisation of 3D and LGAD prototypes. Test set-up ready in the laboratories	30 – CSIC	18	Preliminary characterisation on prototypes with the readout systems to be used with the final productions (Task 6.3)
MS24	Completion of planar sensor production for ACF	8 – CNRS	18	Planar pixel sensor wafers delivered for interconnection tests (Task 6.4)
MS25	Availability of parts and definition of the technologies for wafer to wafer hybridization	16 – UBONN	18	Wafers delivered to IZM and report on the technologies chosen for the interconnection (Task 6.4)

Deliverables

D #	Deliverable name	Lead beneficiary	Type	Due Date (in months)
D6.1	Completion of common productions	30 – CSIC	Report	30
D6.2	Final validation of timing performance of common productions	21 – INFN	Report	46
D6.3	Test of the final ultra-thin hybrid assemblies from wafer-to-wafer bonding	16 – UBONN	Report	44
D6.4	Validation of ACF for large and small pitch assemblies	1 – CERN	Report	45